In the paint and coating industry, putty is an indispensable material that plays a major role in leveling, providing a smooth and delicate base for paint construction and decorative effects. Because of this, putty grinding is a crucial process, and its effect will affect the ease of paint construction, the actual paint consumption, the performance indicators of the paint after it is applied to the wall, and the satisfaction of the final decorative effect.

The current standards for putty polishing tests are mainly the following three : JG/T 298-2010 "Putty for Building Interior Use", GB/T 23455-2009 "Flexible Putty for External Walls" and GB/T 1770-2008 "Determination of Polishing Properties of Coatings and Putty Films". This article will briefly analyze the characteristics and similarities and differences of the three for reference by peers in the industry.

1.  JG/T 298-2010 "Putty for indoor use in buildings"

This standard specifies the technical requirements for indoor putties, including the test method for sandability.

Test method: Use sandpaper to polish the dried putty layer under a certain pressure, and observe the difficulty of polishing and the surface condition.

2.  GB/T 23455-2009 "Flexible putty for exterior walls"

The test method refers to the wear resistance test method in JC/T 985-2005 "Cement-based self-leveling mortar for floor", and the regulations are made on this basis. The grinding method is mechanical grinding (emery cloth attached to grinding wheel or circular grinding) to reduce human interference factors; the various test parameter requirements are mostly range indicators, which are more in line with the actual application scenario requirements of exterior wall flexible putty. However, due to the large differences in product characteristics and application scenarios between self-leveling products and putty, the relevant sample preparation and testing may be difficult for putty products.

3.  GB/T 1770-2008 "Determination of polishability of coatings and putty films"

It is a test method standard specifically for the polishability of coatings and putty films. The polishing method is mechanical polishing (grinding in horizontal direction with sandpaper attached to the polishing head). Although most of the relevant parameter requirements are range indicators, the overall design is more in line with the actual application scenario requirements of putty polishing, and has certain guiding significance for the polishability test of other types of coatings, especially in terms of test instruments and polishing parameters. This indicator does not make specific indicator requirements for the "polishability" test results, and it focuses more on the standardization of test methods rather than result evaluation.

4. Comparison of the specific test methods and parameter indicators of the three

As can be seen from the table, different standards differ in the applicable environment, methods, material selection, operation details, performance judgment and other items of putty grinding. In general, JG/T 298-2010 is easy to operate but the indicators are relatively rough and qualitative, which is suitable for manual indoor putty grinding scenes; GB/T 23455-2009 focuses on quantitative evaluation and is suitable for outdoor mechanical grinding scenes with higher precision; GB/T 1770-2008 has a wider scope of application to various coatings and focuses more on the standardization of grinding test methods.

Understanding the characteristics and differences of these standards and mastering the relevant processing techniques will be of great benefit to the vast number of practitioners and units in the coating, building materials and construction industries. This will help everyone to select appropriate standards and methods based on the working environment and actual needs, and to scientifically and effectively control all aspects such as construction and quality inspection. At the same time, it will improve the professionalism of practitioners, do a good job in putty grinding, and lay the foundation for the smooth progress of subsequent processes.